Electronic Components Background
Global Independent Distributor

Connecting Your Supply Chain to Global Inventory

Committed to Zero-Defect Quality. AS6081 Compliant. Sanhuang Electronic delivers authentic components with speed and reliability, bridging the gap between shortage and production.

Quality Commitment

Rigorous inspection protocols aiming for 100% authenticity. Zero-defect objective.

Massive Inventory

Access to millions of parts. Hard-to-find and obsolete components sourcing experts.

Global Logistics

Same-day shipping capability. Strategic warehousing in Hong Kong & Shenzhen.

Trusted Manufacturers

Independent Distribution - Major Brands Supply

ANALOG DEVICES ST MICROELECTRONICS XILINX INFINEON NXP MICROCHIP RENESAS BROADCOM QUALCOMM TEXAS INSTRUMENTS MAXIM INTEGRATED ON SEMI VISHAY MURATA TDK
ANALOG DEVICES ST MICROELECTRONICS XILINX INFINEON NXP MICROCHIP RENESAS BROADCOM QUALCOMM TEXAS INSTRUMENTS MAXIM INTEGRATED ON SEMI VISHAY MURATA TDK
About Us

20+ Years of Professional Experience

Since 2005, Sanhuang Electronic has evolved into a premier independent distributor in Asia. We specialize in bridging supply chain gaps, offering a reliable source for active, passive, and obsolete components.

Our legacy is built on trust. By partnering with global manufacturers and maintaining strict quality controls, we ensure every component meets the highest standards of authenticity and performance.

Quality First

AS6081 Compliant Testing

Global Sourcing

Worldwide Inventory Access

Electronics Lab
Zero-Defect Commitment

Counterfeit Prevention & Quality Management

Ensuring product authenticity and supply chain integrity through rigorous inspection protocols. AS6081 Compliant processes ensure that only genuine components enter your production line.

Visual Inspection

High-magnification examination for re-tinning, oxidation, blacktopping, and physical anomalies.

Dimensional Check

Measurements compared with datasheet specifications to confirm mechanical conformity.

Marking Tests

Solvent, Scrape, and Heated Chemical tests to detect remarking or blacktopping.

X-ray Analysis

Confirms internal die structure, wire bond layout, and package consistency.

Decapsulation

Destructive test exposing die markings and internal construction for verification.

Electrical Testing

Verifies functionality according to rated electrical specifications.

XRF Analysis

Non-destructive test to identify material composition and RoHS compliance.

Solderability Test

Confirms that part leads can be properly soldered using industry-standard methods.

Contact Us

Get in Touch

Send us your RFQ or any questions. Our team is ready to assist you with your component needs.

Location

Unit 1602, 16/F, Progress Commercial Bldg,
9 Irving St, Causeway Bay, Hong Kong

Request a Quote

or drag and drop

PDF, Excel, CSV up to 10MB